RT Journal Article SR Electronic(1) A1 Alam, Md Ershadul A1 Gupta, Manoj A1 Hamouda, AbdelMagid SalemYR 2012 T1 Development of new lead-free Sn-2.5Mg solder for electronic packaging industries JF , VO 2012 IS 1 OP SP EEP34 DO https://doi.org/10.5339/qfarf.2012.EEP34 PB Hamad bin Khalifa University Press (HBKU Press), SN 2220-251X, AB , UL https://www.qscience.com/content/papers/10.5339/qfarf.2012.EEP34